Silicone Heat Transfer Compound: Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.

Features:

High thermal conductivity

High dielectric constant

High dissipation factor

Use with heat sinks or metal chassis

Will not dry or harden

Contains zincs oxides and polydimenthyl siloxane

Meets MIL-DTL-47113D

Type: Heat Sink Compound

Fill Volume: 4g

Physical State: Paste

Specific Gravity: 2.4

Odor: Odorless

Solubility: Insoluble

Shipping Class: Non-Restricted

Manufacturer: MG Chemicals